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TEPEO®
Products Benecke-Kaliko AG
The Compact Foil and Foam Laminate
State-of-the-art extrusion technology is used in the manufacture of TEPEO® foils.
TEPEO® compact foil and foam laminate is not as heavy as conventional foil. It is nonaging, recyclable and thus environmentally friendly and chemically-physically quite impressive.
Different lacquers in combination with our patented embossing technologies ("leather-simulation", silicon-laser, steel roller technology) allow for a customer-specific surface finish. We continuously expand our product range.
| TEPEO® | Compact foil | Foam laminate |
|---|---|---|
| Structure | TPO compact foil | TPO foam laminate |
| Total thickness (mm) | 0.8 - 1.4 | 2.0 - 3.7 |
| Thickness cover coating (mm) | 0.5 - 0.8 | |
| Foam thickness (mm) | 1.5 - 3.0 |
| Product range TEPEO® |
compact foil | compact foil foam laminate |
compact foil foam laminate |
compact foil foam laminate |
|---|---|---|---|---|
| Processing | Deep drawing / foam molding | Thermal lamination | In-mould graining | LPM process, press molding, low pressure molding (LPM) |
| Surface quality | Good grain quality, virtually infinite grain selection (laser), good harmonization possibility | Good grain quality, virtually infinite grain selection (laser), good harmonization possibility | Limited grain selection (two-gloss effect, real leather technology), high and uniform grain consistency, steel-etched grain well reproducible | Good grain quality, virtually infinite grain selection (laser), good harmonization possibility |
| Recycling | Punch scrap: reusable, basic thermal use | Punch scrap: reusable, basic thermal use | Punching scrap: reusable, basic thermal use | Single-material solution, no bonding agent required |
| Cost-efficiency | Generally high cost level, manufacture of component is high-cost due to two-stage deep drawing/foam backing process; more economical thanks to use of recycled material | Favorable cost level for component manufacture | 25%-30% lower cost than PVC slush; marked reduction in weight (use of expanded vinyl reduces weight of instrument panel by approx. 3.0 kg) | Low cost level for component manufacture |